EMC and the Printed Circuit Board: Design, Theory, and Layout Made Simple"Mark I. Montrose, the best-selling author of PRINTED CIRCUIT BOARD DESIGN TECHNIQUES FOR EMC COMPLIANCE, now brings you his newest book, EMC AND THE PRINTED CIRCUIT BOARD. This accessible, new reference work shows how and why RF energy is created within a printed circuit board and the manner in which propagation occurs. With lucid explanations, this book enables engineers to grasp both the fundamentals of EMC theory and signal integrity and the mitigation process needed to prevent an EMC event. Author Montrose also shows the relationship between time and frequency domains to help you meet mandatory compliance requirements placed on printed circuit boards. Using real-world examples the book features: * Clear discussions, without complex mathematical analysis, of flux minimization concepts * Extensive analysis of capacitor usage for various applications * Detailed examination of components characteristics with various grounding methodologies, including implementation techniques * An in-depth study of transmission line theory * A careful look at signal integrity, crosstalk, and termination" Sponsored by: IEEE Electromagnetic Compatibility Society. |
Contents
| 1 | |
CHAPTER 2 EMC INSIDE THE PCB | 23 |
CHAPTER 3 COMPONENTS AND EMC | 53 |
CHAPTER 4 IMAGE PLANES | 81 |
CHAPTER 5 BYPASSING AND DECOUPLING | 125 |
CHAPTER 6 TRANSMISSION LINES | 159 |
CHAPTER 7 SIGNAL INTEGRITY AND CROSSTALK | 185 |
CHAPTER 8 TRACE TERMINATION | 215 |
CHAPTER 9 GROUNDING | 247 |
GLOSSARY | 279 |
BIBLIOGRAPHY | 287 |
APPENDIX | 291 |
INDEX | 317 |
ABOUT THE AUTHOR | 325 |
Other editions - View all
EMC and the Printed Circuit Board: Design, Theory, and Layout Made Simple Mark I. Montrose No preview available - 2004 |
Common terms and phrases
0V reference analog antenna cables capacitance cause characteristic impedance chassis ground clock common-mode currents components conductor configuration coupling created crosstalk decoupling capacitors Design Techniques device dielectric constant differential-mode currents edge rate effects electric field electronic EMC compliance equation exist Figure filter flux cancellation function ground bounce ground loops ground plane ground stitch heatsink high-frequency IEEE image plane inductor input interconnect internal layer layout lead-length inductance load located logic families loop area low-impedance magnetic field microstrip minimize multipoint grounding noise occur ohms optimal oscillator output package partial inductance PCB trace power and ground power plane power supply Printed Circuit Board propagation delay radiated emissions reference plane resonance RF currents RF energy RF return currents RF return path self-resonant frequency signal integrity signal trace single-point grounding stripline structure switching Thevenin trace length trace route transmission line voltage wire
Popular passages
Page 289 - Investigation of the Effectiveness of DC Power Bus Interplane Capacitance in Reducing Radiated EMI from Multi-Layer PCBs.
Page 250 - Creepage is the shortest path between two conductive parts, or between a conductive part and the bounding surface of the equipment, measured along the surface of the insulation.
Page 160 - CI of a circuit is equal to the square root of L/C, where L is the circuit self-inductance, and C is the capacitance to ground. The parameters L and C are determined by the circuit geometry and the properties of the dielectric.
Page 36 - A law giving the magnetic induction at a point due to given currents in terms of the current elements and their positions relative to the point. Also known as Laplace law.
Page 315 - A: The apparatus shall continue to operate as intended. No degradation of performance or loss of function is allowed below a performance level specified by the manufacturer, when the apparatus is used as intended. In some cases the performance level may be replaced by a permissible loss of performance.