Optical InterconnectsThis book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing. |
Contents
| 1 | |
| 9 | |
VCSEL Characterization | 23 |
Thermal Management of Embedded VCSEL | 31 |
Optical Interconnection Layer | 39 |
System Integration | 65 |
Summary | 73 |
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Common terms and phrases
850 nm VCSEL active region AlGaAs aspect ratio board level optical bonding characteristics coupling efficiency cross-talk current aperture dB/cm deviation from 45 dissipated power electrical layers electroplated embedded board level embedded VCSEL epitaxial epitaxial layers etch stop layer etchant fabrication process FIGURE flexible waveguide film fully embedded board fully embedded board-level function heat sink inside the VCSEL integration joule heating laser drilled level optical interconnects material microtome mirror surface modulation molding process optical interconnection layer optical layer optical waveguide optoelectronic Optowell packaging pattern photoresist polymer printed circuit board propagation loss pulse width refractive index removed semiconductor shown in Fig Si-wafer signal silicon simulation results spin coat substrate substrate thickness surface emitting laser technique Temperature distributions thermal conductive thermal conductive paste thermal management thermal resistance thermal-via structures thick VCSEL thin film VCSEL thin-film Topas film various thick VCSELs wafer waveguide mirrors wavelength wavelength shift µm thick
Popular passages
Page 1 - The speed and complexity of integrated circuits are increased rapidly as integrated circuit technology advances from very large scale integrated (VLSI) circuits to ultra large scale integrated (ULSI) circuits. As the number of components per chip, the number of chips per board, the modulation speed and the degree of integration continue to increase, electrical interconnects are facing their fundamental bottlenecks, such as speed, packaging, fanout, and power dissipation. Multichip module (MCM) technology...
Page 1 - ... integrated circuit technology advances from very large scale integrated (VLSI) circuits to ultra large scale integrated (ULSI) circuits. As the number of devices per chip, the number of chips per board, the modulation speed, and the degree of integration continue to increase, electrical interconnects are facing their fundamental bottlenecks, such as speed, packaging, fan-out, and power dissipation. In the quest for...
Page 32 - I(t)Va (10) where T is the temperature, K is the thermal conductivity, p is the density, Cp is the specific heat...
Page 90 - Sandia is a multiprogram lab operated by Sandia Corporation for the US Dept. of Energy under Contract DE-AC04-94AL85000. References [1] KD Choquette and KM Geib, "Fabrication and Performance of Vertical Cavity Surface Emitting Lasers", Chap. 5 in Vertical Cavity Surface Emitting Lasers, ed.
Page 90 - The mechanism of anisotropic, electrochemical silicon etching in alkaline solutions," IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC, 1990, p.
Page 90 - Van der Waals Bonding of GaAs on Pd Leads to a Permanent, Solid-Phase-Topotaxial Metallurgical Bond.
Page 1 - The employment of copper and materials with lower dielectric constant materials can release the bottleneck in a chip level for the next several years. The ITRS expects on chip local clock speed will constantly increase to 10 GHz by year 2011.
Page 7 - ... cavity surface emitting laser (VCSEL), surface-normal waveguide couplers, and a polymer-based channel waveguide functioning as the physical layer of optical interconnection. The driving electrical signals...
Page 39 - To efficiently couple optical signals from vertical cavity surface emitting lasers (VCSELs) to polymer waveguides and then from waveguides to photodetectors, two types of waveguide couplers are investigated. They are tilted grating couplers and 45° waveguide mirrors.