36th Electronic Components Conference: May 5-7, 1986, Westin Hotel, Seattle, Washington

adhesion AIN substrate alloy alumina aluminum analysis applications ball bonding capacitance capacitors ceramic chip coefficient components conductor connector conventional cooling copper corrosion couplers crack density developed devices die attach dielectric dissipation effect electrical Electronic electroplated epoxy equation evaluated experimental failure fiber firing function gold heat heatspreader humidity hybrid hybrid circuits IEEE increase inlay integrated circuit interface laser layer lead frame leadframe leakage current manufacturing material measured mechanical metal module molding compound multilayer optical optical fiber oxide oxygen package pads palladium parameters PC board performance plastic plated PLCC polyimide printed circuit board production reliability resistor samples semiconductor shown in Figure shows signal silicon sintering solder joint stress structure substrate surface mount Table technique temperature thermal conductivity thermal cycling thermal resistance thick film thin film transistor voltage wire bonding